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工控主板可以在-20℃~60℃之間穩定、無故障的工作
2017-03-08 15:28:39 新聞來源:驚爆草莓污視頻:深圳市澤創偉業科技有限公司
工控主板,由于其設計用(yong)(yong)料的工業(ye)(ye)性,除支持(chi)PCI插槽外,同(tong)時可以支持(chi)MiniPCI-E、PC104+、COM口等接口,內嵌GPIO總線,可以實現GPI,GPO作用(yong)(yong),而且工業(ye)(ye)半(ban)長卡、全場卡能(neng)和(he)底板配合更具擴展性支持(chi)多個ISA、PCI、MINIPCI擴展。
工(gong)(gong)(gong)(gong)控(kong)主(zhu)(zhu)板(ban)(ban)(ban)從設計,用(yong)(yong)料,生產,制造都是經過嚴格的篩選和(he)測試,保(bao)證工(gong)(gong)(gong)(gong)控(kong)用(yong)(yong)戶(hu)正常、高可靠性的使用(yong)(yong)。同時也(ye)應該了解為(wei)什么工(gong)(gong)(gong)(gong)業(ye)(ye)(ye)主(zhu)(zhu)板(ban)(ban)(ban)會(hui)(hui)比(bi)商用(yong)(yong)主(zhu)(zhu)板(ban)(ban)(ban)貴。雖然工(gong)(gong)(gong)(gong)業(ye)(ye)(ye)主(zhu)(zhu)板(ban)(ban)(ban)貴,但現(xian)在很(hen)多以前用(yong)(yong)開商用(yong)(yong)主(zhu)(zhu)板(ban)(ban)(ban)的客戶(hu)也(ye)開始改用(yong)(yong)工(gong)(gong)(gong)(gong)業(ye)(ye)(ye)主(zhu)(zhu)板(ban)(ban)(ban)了,因(yin)為(wei)對于(yu)一些工(gong)(gong)(gong)(gong)程項目來(lai)說,采(cai)用(yong)(yong)工(gong)(gong)(gong)(gong)業(ye)(ye)(ye)主(zhu)(zhu)板(ban)(ban)(ban)會(hui)(hui)使整(zheng)(zheng)個項目成(cheng)本降(jiang)低。采(cai)用(yong)(yong)工(gong)(gong)(gong)(gong)業(ye)(ye)(ye)主(zhu)(zhu)板(ban)(ban)(ban)后,減少(shao)了后期的人工(gong)(gong)(gong)(gong)維護成(cheng)本和(he)使用(yong)(yong)成(cheng)本,而且提高了系統的穩定性。而且隨著主(zhu)(zhu)板(ban)(ban)(ban)元(yuan)器(qi)件(jian)的價(jia)格下(xia)降(jiang)工(gong)(gong)(gong)(gong)控(kong)主(zhu)(zhu)板(ban)(ban)(ban)和(he)商用(yong)(yong)主(zhu)(zhu)板(ban)(ban)(ban)的價(jia)差拉近了很(hen)多,總的來(lai)看整(zheng)(zheng)體成(cheng)本是降(jiang)低了。
隨著(zhu)驚爆草莓污視頻:工控主板價格的下(xia)降,一些對電(dian)腦作用(yong)要(yao)求(qiu)單(dan)一但(dan)穩定(ding)性要(yao)求(qiu)高的場(chang)合,如(ru)多(duo)媒(mei)體廣告(gao)系統、證券交易系統等等很多(duo)都改用(yong)了工控(kong)主(zhu)板,一些單(dan)片機應用(yong)的機床控(kong)制也開始改用(yong)工控(kong)主(zhu)板,因為(wei)工控(kong)主(zhu)板價格在用(yong)戶(hu)接受(shou)范圍,并能到(dao)達高穩定(ding)性,在X86架構下(xia)大大減輕了軟件編程難(nan)度,大大降低人工成本。
工控主板的應用面越來越廣(guang),也(ye)證明(ming)了用戶(hu)對(dui)主板品(pin)質(zhi)要求的提高。
工作溫(wen)度和(he)散(san)熱(re):工控(kong)主板可以在-20℃~60℃之(zhi)間穩定、無故(gu)障的(de)(de)工作,甚至(zhi)某些工業主板采用(yong)特(te)殊的(de)(de)寬溫(wen)設計(ji),溫(wen)度范圍可達-20度~70度。這對機(ji)構(gou)的(de)(de)散(san)熱(re)方案,散(san)熱(re)效率(lv)都是一(yi)個嚴峻的(de)(de)考驗。在工控(kong)主板機(ji)構(gou)的(de)(de)散(san)熱(re)設計(ji)上(shang),必(bi)須使用(yong)全鋁制的(de)(de)機(ji)構(gou)外(wai)殼和(he)特(te)殊的(de)(de)散(san)熱(re)設計(ji),而且對CPU、南(nan)北橋和(he)硬盤(pan)等(deng)發熱(re)大戶,進行特(te)殊處理,保(bao)證工控(kong)主板和(he)整機(ji)的(de)(de)正常運行。